Samco FlexLiner II Oberflächenbehandlungssysteme

Manufacturer: Samco

Model: FlexLiner II

Year of Manufacture: 2018

Type of Machine : UCP plasma machine

The samco-ucp FlexLiner II is a production type plasma cleaning system designed for surface cleaning of various types of leadframe packages. This system operates with a remote plasma source in the downstream process mode. The plasma is generated by RF power in the source and then injected into the process chamber through a shower head. Dimensions: 1,520 mm (W) x 1,410 mm (D) x 2,130 mm (H)

Key Features and Benefits

- Single substrate production equipment for various types and dimensions of substrates and magazines up to 300 mm x 300 mm
- Gentle handling with minimal movement of substrates and magazines
- Touchscreen GUI for user-friendly, intuitive operation
- Multiple sensor controls for highly reliable operation
- High throughput due to simultaneous (un)loading and plasma processing
- Typical process gases Ar, H2 and N2 for optimum surface activation and soft chemical removal

Applications

- Surface cleaning of metal leadframes, plastic microelectronic packages, MEMS or micro-optic packages, hybrid or multi-chip modules
- Surface treatment for improvement of gluing, bonding or encapsulation
- Mainly surface activation and removal of oxides or organic residues
- Optimum plasma processing for a variety of materials in semiconductor technology

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